パワーモジュール

Power module

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that the miniaturization of a power module by increasing the mounting density is difficult, because the insulating metallic substrate of the power module is required to secure the width of a main-circuit wiring pattern and the distance between patterns in accordance with the magnitude of a current or voltage flowing through a circuit in addition to the area of the main body of a mounted electronic control component and, in addition, the number of mounted components increases and the easiness in assembling becomes worse even when the area of the main-circuit wiring pattern on the insulating metallic substrate is reduced by using many three-dimensional wiring components. <P>SOLUTION: The area of the insulating metallic substrate can be reduced and the increase of the number of components can be prevented by integrally forming the three-dimensional insulating metallic substrate wiring material of the main-circuit wiring pattern in a power module case in addition to the conventional external circuit connection terminals. <P>COPYRIGHT: (C)2005,JPO&NCIPI
【課題】パワーモジュールの絶縁金属基板は、実装する電子制御部品の本体面積以外に、回路を流れる電流・電圧の大きさに応じ主回路配線パターンの幅やパターン間の距離確保が必要であり実装密度向上によるパワーモジュールの小型化が困難である。 また、立体配線部品を多用し絶縁金属基板上の主回路配線パターンの面積を削減しても、実装する部品の数が増加し組立性が悪くなる。 【解決手段】上記課題を解決するためには、パワーモジュールケースに従来の外部回路接続端子に加え、主回路配線パターンの絶縁金属基板立体配線材を一体的に形成することで、絶縁金属基板面積の削減と部品点数の増加防止が可能となる。 【選択図】 図1

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